| 摘要 |
<p>PURPOSE:To increase the number of pins for leads and to draw the leads by leaving a margin. CONSTITUTION:Auxiliary leads 5 are formed so as to protrude at four corners of a die pad 3 on which a semiconductor element 7 is mounted. Tips of a plurality of leads 4 are extended to the circumference of the die pad 3 they are connected electrically to electrodes 8 on the semiconductor element 7 via wires 9. Base parts of the leads 4 are connected to a frame 6. Tip parts of the auxiliary leads 5 are laid between the tip parts of the leads 4; they are connected to the leads 4 via an adhesive by using an insulating plate 10.</p> |
