| 发明名称 |
Substrate provided with electric lines and its manufacturing method. |
| 摘要 |
<p>An opening (15) is formed in an insulating film (14) which covers a electric line (12) formed on a substrate (11) and a pad connecting portion (13) of the electric line is exposed and a pad is constructed. In this case, the pad connecting portion is set to a size having an allowance size 2 larger than a size L of the pad to be formed. The opening is set to a size having an allowance size 2d larger than a width D of the pad connecting portion and is formed so as to cross the pad connecting portion. Even when a positional deviation occurs in an opening which is formed in an insulating film, it is permitted and pads each having a predetermined area are formed with a predetermined positional relation. <IMAGE></p> |
| 申请公布号 |
EP0516402(A1) |
申请公布日期 |
1992.12.02 |
| 申请号 |
EP19920304808 |
申请日期 |
1992.05.28 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
SHIRAI, MASAHARU;YAMANAKA, KIMIHIRO |
| 分类号 |
H01L21/48;H01L23/538;H05K1/11;H05K3/34 |
主分类号 |
H01L21/48 |
| 代理机构 |
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代理人 |
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