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发明名称
SEALING APPARATUS WITH RESIN FOR CHIP
摘要
申请公布号
JPH04346235(A)
申请公布日期
1992.12.02
申请号
JP19910118295
申请日期
1991.05.23
申请人
MATSUSHITA ELECTRIC IND CO LTD
发明人
NISHI TOSHIO;WADA YOSHIYUKI
分类号
H01L21/56;H05K3/28
主分类号
H01L21/56
代理机构
代理人
主权项
地址
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