| 摘要 |
<p>PURPOSE:To obtain a resist applicating device with which resist film thickness can always be measured and the preset resist thickness can be obtained accurately based on the result of the above-mentioned measurement. CONSTITUTION:A metal plate 1 which is provided along the outer circumference of a wafer W and fixed to a rotatable supporting plate 2 carrying the wafer W, a measuring means 6 with which the film thickness R of the resist, applied to the metal plate 1, is measured, and a calibration means 7, with which the number of rotation of the supporting plate 2 is changed so as to obtain the desired resist film thickness R based on the result of the above-mentioned measurement, are characteristically provided in the title resist applicating device.</p> |
