| 摘要 |
PURPOSE:To increase the heat-dissipating effect of an IC chip mounted in a flip-chip manner. CONSTITUTION:An IC chip 1 is bonded facedown inside a cavity 4 formed in an electric wiring board 3 via electrodes on the IC chip 1 and via electric wiring electrodes 5. It is sealed with a resin whose heat conductivity is high so as to be stretched over the rear 6 of the IC chip 1 and the sidewall 7 of the cavity 4. Heat generated from the IC chip 1 is conducted to the whole of the board 3 and dissipated. Even the IC chip whose heat-generating amount is large can be mounted in a flip-chip manner; it can be mounted at higher density. As a result, an electronic apparatus can be constituted so as to be ultrasmall and ultrathin. |
