DIE FOR MOLDING RESIN SEALING PART OF ELECTRONIC COMPONENT

摘要

PURPOSE:To prevent failure in molding when the resin sealing part of a diode is transfer-molded by the use of epoxy resin. CONSTITUTION:A resin sealing part 2 has a truncated cone shape part 4 in the end part of a columnar shape part 3. A gate 26 formed into a tapered shape toward a cavity is opened to the truncated cone shape part A. Moreover, the axial direction obliquely intersects for the generatrix direction of the surface of the truncated cone shape part 4. The shape of the tip part of the cavity side of the gate 26 is set so that thickness is nearly specified along the generatrix direction of the surface of the truncated cone shape part 4. Thereby, flow of resin to the cavity from the gate 26 is smoothened.