| 摘要 |
PURPOSE:To obtain the title adhesive excellent in bonding strength and scarcely forming voids even when no pressure is applied to a semiconductor element for bonding, and excellent in heat resistance by using a polymer having at least a specified amount of repeating units shown by a specified formula and an inorganic filler as constituents. CONSTITUTION:The title adhesive contains a polymer containing at least 10mol% repeating units of formula I [wherein X is of formula II or III; R1 is H or a monovalent organic group (e.g. CH3, C2H5 or a group of formula IV); R2 is a tetravalent organic group (e.g. a group of formula V, VI, VII or VIII)] in the polymer molecule and an inorganic filler. By using this adhesive for bonding a semiconductor element to a ceramic container, hermetic sealing can be accomplished with excellent bonding strength and heat resistance and little occurrence of voids. |
