LEAD FRAME-CHIP PACKAGE WITH IMPROVED CONFIGURATION,申请号US19910697827-传众专利搜索

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发明名称	LEAD FRAME-CHIP PACKAGE WITH IMPROVED CONFIGURATION
摘要
申请公布号	US5168368(A)	申请公布日期	1992.12.01
申请号	US19910697827	申请日期	1991.05.09
申请人	INTERNATIONAL BUSINESS MACHINES CORPORATION	发明人	GOW, 3RD, JOHN;NOTH, RICHARD W.
分类号	H01L21/60;H01L23/495	主分类号	H01L21/60
代理机构		代理人
主权项
地址

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