发明名称 SOLDER RESIST INK COMPOSITION AND CURED ITEM THEREOF
摘要 <p>PURPOSE:To prepare the title compsn. which has a high heat distortion temp., gives a cured item excellent in heat resistance, electrical insulation, hardness, and resistance to moisture, chemicals, and plating, and bleeds little by compounding a specific epoxy resin as the main component. CONSTITUTION:The title compsn. is prepd. by compounding an epoxy resin of the formula as the main component with a curative, a solvent, and other necessary additives.</p>
申请公布号 JPH04345673(A) 申请公布日期 1992.12.01
申请号 JP19910146605 申请日期 1991.05.23
申请人 NIPPON KAYAKU CO LTD 发明人 YOKOSHIMA MINORU;OKUBO TETSUO;SASAHARA KAZUNORI
分类号 C08G59/24;C08G59/20;C09D11/02;C09D11/033;C09D11/10;C09D11/102;G03F7/20;H01L21/027;H05K3/28 主分类号 C08G59/24
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