| 摘要 |
An exposure apparatus for selectively exposing the peripheral portion of a circular substrate such as wafer for integrated circuit manufacturing purposes. In this exposure apparatus, the spot of an exposure light beam from a projecting system is projected onto the peripheral portion of a resist-coated surface of a substantially circular substrate in such a manner that a part of the spot projects from the peripheral edge of the substrate. The portion of the spot projecting from the peripheral edge of the substrate is received by a detector arranged opposite to the projecting system through the intermediary of the substrate peripheral portion so that the position of the substrate peripheral edge in the projected spot is detected in accordance with the contour position of the received spot portion. During rotation of the substrate, in accordance with the detection signal the projecting system is controlled to move in the radial direction of the substrate in response to the displacement of the substrate peripheral edge so that the exposure light beam always illuminated the peripheral portion of the substrate within a given dimensional extend in the radial direction. Further, in the present exposure apparatus the rotational speed of the substrate and the exposure conditions by the spot formed on the substrate peripheral portion by the light beam (the intensity and/or size of the integrated exposure light) are controlled in such a manner that the exposure light quantity applied to the substrate peripheral portion by the spot attains a predetermined proper exposure light quantity.
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