| 摘要 |
PURPOSE:To obtain the mounting structure for a semiconductor element which can simply and precisely form a protective film, and precisely align an element with a wiring pattern on an external circuit board, in the case of bonding a flip chip system. CONSTITUTION:By using a heat fusion type insulating film 3 provided with through holes 4 into which metal protrusions 2 of a semiconductor element 1 can be inserted, the semiconductor element 1 is mounted on a wiring pattern 5 formed on an outer circuit board 6. By heating, the insulating film 3 is melted and acts as a protective film. |
