| 摘要 |
PURPOSE:To provide the method and device for baking with which uniformity of baking can be improved when the resist applied to a wafer is baked. CONSTITUTION:The title baking device is constituted by a plurality of linear heat generating elements 2a lined up in parallel with each other longer than the outside diameter of a wafer W, and a heater 2 which can be moved in the direction of the row of the heat-generating elements 2 on the plane region which is wider than the wafer W. Resist-applied wafers W are opposingly arranged in parallel with each other leaving an interval against the row of the heat-generating elements 2a on the plane region, and the resist is baked while the row of the heat-generating elements 2a are being moved. The row of the heat-generating elements 2a can be endlessly rotated because the elements 2a are supported on two rotatable axes 3. The heat-generating elements 2a are arranged on the whole length of a film 1 which forms a plane region between the two axes 3, and the movement of the row of the heat-generating elements 2a is conducted by the rotation of the film 1. 4 in the diagram is the motor with which the axes 3 are rotatingly driven, 5 is a wafer retaining means, and 6 is the power-feeding means for the heater 2. |
