| 摘要 |
PURPOSE:To efficiently thermal-bond an electronic part and a matter to be bonded with high conductive reliability of the connection part via a conductive adhesive agent by temperature-controlling the stage. CONSTITUTION:A space 5 is formed at the lower side of a thermal bonding part 6 in a stage 1, to which cooling and heating liquids are supplied selectively, and at the time of heating a matter 16 to be bonded by a heater chip 20 equipped with heating means and cooling pipe 22, heated liquid is supplied into the space 5 and after heating, cooled liquid is supplied into the space 5, thereby efficiently rapidly heating and cooling an electric part 15, a conductive adhesive agent 17, and the matter 16 to be bonded. |
