发明名称 |
ADHESIVE TAPE STICKING DEVICE |
摘要 |
<p>PURPOSE:To obtain an inexpensive adhesive tape sticking device which has such a simple constitution that a semiconductor wafer can be manually set to a ring frame and no special apparatus is required for giving tension to an adhesive tape. CONSTITUTION:A peel plate 7 which peels an adhesive tape from a release frame 5 and a press roller 43 which is provided near the plate 7 and makes free rotation when the roller 43 is moved at its upper position and driven rotation when the roller 43 is moved at its lower position are provided and a table 56 mounted with a semiconductor wafer and ring frame is provided in such a state that the table 56 can freely make reciprocating motions between a position below the roller 43 and another position separated from the position and the table 56 can be brought into contact and separated from the roller 43. The release film 5 is driven by means of a torque motor and a tension roller 6 which works in conjunction with a pinch roller and a drive roller 8 give tension to the film.</p> |
申请公布号 |
JPH04340746(A) |
申请公布日期 |
1992.11.27 |
申请号 |
JP19910112833 |
申请日期 |
1991.05.17 |
申请人 |
LINTEC CORP |
发明人 |
KOBAYASHI KENJI;SAITO HIROSHI;KAWARADA KENJI;TSUJIMOTO MASAKI |
分类号 |
H01L21/683;H01L21/301;H01L21/68;H01L21/78 |
主分类号 |
H01L21/683 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|