| 摘要 |
PURPOSE:To reduce time and labor for preparing a drawing for reference wire bonding. CONSTITUTION:CAD data of an existing lead frame is registered as a library 107. When a lead frame which fits for an objective chip is not found, the library 107 is searched by a lead frame searching means 103 and one lead fame is decided whose base pad size is the closest to adaptability conditions based on base pad size and chip size of the lead frame. A drawing for wire bonding which serves as reference when a lead frame is designed is prepared by a wire bonding drawing preparation means 104. |
