SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND ITS PACKAGE STRUCTURE

摘要

PURPOSE:To improve package density by reducing heat resistance of a tape carrier package. CONSTITUTION:Tape carrier packages 1 of the specified numbers wherein a heat sink 8 is joined on an element formation surface of a semiconductor chip 5 are laminated to bring the heat sink 8 of the semiconductor chip 5 mounted on one tape carrier package 1 into contact with a rear of the semiconductor chip 5 mounted on the other tape carrier package 1.