| 摘要 |
<p>PURPOSE:To provide a photosensitive resin compsn. having high thermal stability which can be developed in an alkali aq. sol and can form a highly reliable solder mask excellent in various performances. CONSTITUTION:The photosensitive resin compsn. consists of the following components. (a) Oligomer having carboxyl group and photoreactive unsatd. group in the side chain and soluble in an alkali aq. soln., (b) compd. having at least two epoxy groups, (c) sensitizer and/or sensitizer group which produces free radicals by irradiation of active ray, (d) heterocyclic compd. expressed by formula (I), and (e) guanidine compd. The photosensitive element has a layer of this compsn. formed on a supporting film. In formula, X is for example, benzene ring and the like.</p> |
