SEMICONDUCTOR DEVICE AND MEMORY CARD

摘要

PURPOSE:To obtain a thin semiconductor device having thickness of about 0.5-0.8mm as a whole and a memory card having memory capacity larger than conventional one and excellent in reliability. CONSTITUTION:The circuit forming surface 10 of a semiconductor chip 1 and an element supporting lead 2s are provided to the same surface of an insulating film 3 and the wire connecting surfaces of both of them are constituted on the same plane to be sealed with a resin to obtain a semiconductor device. This semiconductor device is mounted on both surfaces of a board and received in a case to obtain a memory card.