| 摘要 |
<p>PURPOSE:To make tensile rupture easy in a narrow strip 13 and to suppress the damage to a resin and a semiconductor chip to a minimum in the method of manufacturing a resin-sealed semiconductor device. CONSTITUTION:A lead frame 1 in which small cross-section parts 17, 18 for narrow-strip rupture use have been formed in narrow strips 12, 13 and in which holes 27 for stress relaxation use have been formed between the small cross-section parts 17, 18 and a semiconductor chip 2 is prepared. After the lead frame 2 has been mounted on a metal mold 19, a resin for sealing use is pressed into a cavity 22 in the metal mold 19. After the resin for sealing use has been solidified, the lead frame 1 is taken out from the metal mold 19, a tensile force is exerted on the narrow strips 12, 13 and the narrow strips 12, 13 are ruptured at the small cross-section parts 17, 18. When a tensile stress is exerted on minimum cross-section parts 17a, 18a in a concentrated manner, the narrow strips 12, 13 can be tensile-ruptured easily. A deformation force which is transmitted to a support plate 3 is relaxed by the holes 27 during their tensile rupture operation. As a result, a deformation force which is transmitted to the semiconductor chip 2 is reduced remarkably.</p> |
