发明名称 RESIST PATTERN FORMING METHOD
摘要 PURPOSE:To improve the cross-sectional form of the resist pattern high in resolution. CONSTITUTION:The thin resist film 2 formed on the substrate 1 to be processed is developed only on the surface part by the developing conditions different from those on the area other than the surface part, and after the hardly- solubilized layer 3 formed on the surface part of the layer 2 has been developed, normal development is carried out by the usual developing conditions, thus permitting the resist pattern 8 of a desired cross-sectional form to be obtained. When alkali is used for the development, the surface part is developed with a developing solution of higher concentration, and then, it is developed with a developing solution of usual concentration.
申请公布号 JPH04338960(A) 申请公布日期 1992.11.26
申请号 JP19910100192 申请日期 1991.05.01
申请人 DAINIPPON PRINTING CO LTD 发明人 KURIHARA MASAAKI;FUJITA HIROSHI;TAKAHASHI YOICHI
分类号 G03F7/038;G03F7/30;H01L21/027;H01L21/30 主分类号 G03F7/038
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