HEAT SINK AND ELECTROMAGNETIC INTERFERENCE SHIELD ASSEMBLY

摘要

The present invention provides a heat sink and electromagnetic interference shield assembly for a plurality of semiconductor elements. The semiconductor elements are connected with other circuit elements to form an electrical circuit. Each semiconductor element has a metal portion for dissipating heat generated by the semiconductor element. The metal portion also emits electrical energy as a result of the operation of the semiconductor element thereby causing unwanted electromagnetic interference. The assembly comprises an insulator attached to the metal portion of the semiconductor element and a substrate for mounting the plurality of semiconductor elements. The substrate has a metal base layer, a middle insulating layer, and a plurality of metal mounting areas for mounting the metal portion of the semiconductor elements. The electrical energy emitted by each semiconductor element is capacitively coupled to its corresponding metal mounting area. The assembly also contains a means for returning the electrical energy coupled to the metal mounting area to one of the circuit elements such that the amount of electromagnetic interference is reduced.