| 摘要 |
A handler system (10) for transferring circuit packages, such as integrated circuits, from a tray (28) containing a batch of the integrated circuits to a testing socket (41) at a test site enjoys the advantages of high precision placement of the integrated circuit in the testing socket (41) to achieve greatly reduced lead bending and damage to the integrated circuit body. Such precision is achieved by a simple mechanism wherein the travel of the integrated circuit from the tray (28) to the test site and back to a selectable one of the good tray (28) and the reject tray (27) is performed exclusively along a single axis of movement of a carrier (34). The linear bidirectional motion of the carrier (34) is limited to the z-axis, and eliminates misalignment which might result from wear of a ball screw and nut. The system is controlled by a computer which contains in its memory information relating to the dimensions of the trays and the types of circuit packages which are to be tested. |
