| 摘要 |
<p>PURPOSE:To prevent a phenomenon that at a chip do not separate sad from a chip and to enhance the manufacturing yield of semiconductor devices regarding the dicing method of a semiconductor substrate. CONSTITUTION:A first ultraviolet-curing adhesive, tape 11 is pasted on the rear of a semiconductor substrate 1; after that, dicing grooves 3 are formed; the semiconductor substrate 1 is divided into individual semiconductor chips 2; in addition, the first adhesive tape 11 is irradiated with ultraviolet rays and its adhesive power is weakened; after that, a second ultraviolet-curing adhesive tape 12 is pasted on the surface of the semi-conductor chips 2; then, the first adhesive tape 11 is separated. In addition, the second adhesive tape 12 is irradiated with ultraviolet rays and its adhesive power is weakened; after that, a third adhesive tape 13 is pasted on the rear of the semiconductor chips 2; then, the second adhesive tape 12 is separated.</p> |
