| 摘要 |
<p>A package for storing and transporting a single wafer of silicon or the like which may be 300 millimeters or more in diameter. The package has a U-shaped frame with a ledge on it for supporting the edge of a wafer, the open side of the U-shaped frame permitting insertion and removal of a wafer; a top panel affixed to the U-shaped frame and traversing the U-shaped frame defining a wafer compartment with the frame, and confining the wafer therein; a retainer traversing the open side of the compartment to obstruct removal of the wafer; wafer clamping devices confronting the ledge to clamp the edge portion of a wafer thereon; an access slot through the ledge portion of the frame to obtain access to the edge of the wafer for lifting it; the entire frame portion being open in a downward direction as to open the lower side of the wafer compartment to allow obtaining access to the wafer; the frame also having stacking ribs and grooves; a robot handle on the top panel and an adjacent operator for the retainer to also be operated by a robot.</p> |
