| 摘要 |
<p>PURPOSE:To constitute the sealing process of a semiconductor device in an in-line manner and to perform an assembly process up to a sealing process as a continuous process by a method wherein a base body is provided with a resin layer which has been adjusted so as to be used to seal the semiconductor device. CONSTITUTION:The fundamental constitution of a semiconductor device is composed of the following: a semiconductor device 2; and a constituent body 1, for sealing use, which is provided with a resin layer for sealing use in advance. The semiconductor device is manufactured by uniting and sealing both. As sealing methods, the following are available: a method to cover and seal only one side of the semiconductor device 2; and a method to cover and seal the semiconductor device 2 from both sides so as to be wrapped in a sandwich shape. The semiconductor device 2 and the constituent body 1 for sealing use are fed so as to correspond to each other in a one-to-one manner onto a line in order to produce the semiconductor device continuously. Since a sealing process can be constituted in an in-line manner, a flexible manufacturing method which is suitable for a multiplied low-production method can be constituted.</p> |
