VERFAHREN ZUM HERSTELLEN EINER HALBLEITERANORDNUNG WOBEI EIN FILMTRAEGERBAND ANGEWENDET WIRD.

摘要

A method of manufacturing a semiconductor device employing a film carrier tape during process steps thereof is disclosed. Any test pad is not provided in the film carrier tape. Therefore, the semiconductor element carried in the film is cut at the leads and separated from the film carrier tape without conducting any electrical test. The separated semiconductor element is conducted the electrical test by installing it on a testing substrate which is provided to adapt to a large number of terminals.