发明名称 POLYAMIDE RESIN COMPOSITION
摘要 PURPOSE:To obtain a polyamide resin composition having high transparency and excellent mechanical properties such as impact resistance by compounding a transparent polyamide resin with a specific styrene-butadiene copolymer and/or its modified product. CONSTITUTION:The objective resin composition is composed of (A) 95-60wt.% of a transparent polyamide resin composed of (A1) 100-30wt.% of a polyamide- forming unit consisting of isophthalic acid and/or terephthalic acid and a diamine of formula (R<1> and R<2> are H or 1-3C alkyl; n is integer of 0-6; H of the cyclohexane ring may be substituted with 1-3C alkyl) and (A2) 0-70wt.% of a polyamide-forming unit consisting of an omega-amino acid, a lactam or an aliphatic diamine and an aliphatic dicarboxylic acid and (B) 5-40wt.% of a styrene-butadiene copolymer (or its modified product) containing 15-45wt.% of styrene component. The composition may be further incorporated with <=80 pts.wt. of one or more fillers selected from glass fiber, glass flake and glass bead based on 100 pts.wt. of the composition.
申请公布号 JPH04337355(A) 申请公布日期 1992.11.25
申请号 JP19910110546 申请日期 1991.05.15
申请人 MITSUBISHI KASEI CORP 发明人 NAKAJIMA TAKASHI;AIHARA TOSHIHIKO;HAYAZAKI HIDEHIRO
分类号 C08L77/00 主分类号 C08L77/00
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