| 摘要 |
PURPOSE:To provide a connecting structure, a connecting method and a connecting device between a substrate and a chip part permitting high-density connection and high reliability at a low cost by shortening the wiring pitch intervals. CONSTITUTION:A solder bump 23 formed on a connecting pad 22 of IC chip part 21 is firmly touched to a wiring conductor 12 on a film substrate 11. At this time, a predetermined pressure is applied to the top of the solder bump 23, and all the solder bumps 23 are arranged to the same height. This pressure is reduced or a non-pressure stated is brought about, and then the solder bumps 23 are heated and melted. At this time, the gap between a chip part 21 and substrate 11 is adjusted, the solder bumps 23 are extended longer than the height before melting, and almost a straight drum form or a tabor form is created. Under this condition, the solder bumps 23 are cooled off and solidified, and then a connected structure is obtained which has the chip part 21 connected to a wiring conductor 12 on the substrate 11 with almost drum-shaped or tabor- shaped solder bumps 23. |
