Electronic power device realized by a series of elementary semi-conductor components connected in parallel and related manufacturing process.

摘要

A number of modular elementary power components is provided in the same number of chips of a same slice of semiconductor material. Each component has its own cathodic metallization insulated on one side of the slice and side buses running around said metallization and connected with the control electrode of the component. A second series of buses (central buses) leading to a common metallization area in the centre of a same side of the slice has a crossed arrangement so as to form a lattice comprising inside each mesh the cathodic metallization of a respective chip and the corresponding side buses. A series of connection elements, at least one for each elementary semiconductor component of the slice, connects the side buses of each elementary component with the neighbouring central buses. Said connection elements allow very easy deactivation of the elementary components which prove defective on testing.