| 摘要 |
PURPOSE:To satisfactorily connect a lead small-gage wire through a simplified process. CONSTITUTION:A heat-dissipating plate (2) equipped with a pedestal part (1) is integrally formed by forging, the surface of the pedestal part (1) of the heat- dissipating plate (2) is smoothed by cutting, grinding or polishing, and a thin lead wire (7) is connected with the smoothed surface of the pedestal part (1). The surface of the pedestal part (1) of the heat-dissipating plate (2) formed of forging is free of unfilled parts such as bubble or void and no mold release agent attaches thereto. Therefore, the surface of the pedestal part (1) can be finished to a sufficient smoothness by a minor cutting, grinding or polishing treatment without requiring the removing treatment of a mold release agent or a plating or soldering treatment. |
