| 摘要 |
PURPOSE:To simplify a processing work for coupling both interconnection layers by burying a solder ball in a viahole formed in a multilayer interconnection structure having interconnection layers on both side surfaces of an insulating layer. CONSTITUTION:After a viahole 1 is opened by a mold pressing opening method in a state that an interconnection layer 4 is provided on an insulating layer 5, an interconnection layer 7 of a copper foil is adhered on a lower surface through an epoxy series adhesive layer 6. A solder ball 8 is buried in the viahole 1 thereby to couple both the layers 4, 7. As a method for burying the ball, an end of an interconnection passed through the hole of a capillary 10 is melted by an arc discharge in an (Ar+H2) atmosphere from a line 14 to form a ball 12, and connected by a thermal press-bonding method together with an ultrasonic wave. Thus, a multilayer interconnection structure can be efficiently manufactured. |
