发明名称 |
Process of producing aluminum nitride multiple-layer circuit board. |
摘要 |
<p>A process of producing a multiple-layer circuit board of aluminum nitride, comprising the steps of: preparing green sheets of aluminum nitride, forming on the green sheets conductor patterns of a conductor paste containing tungsten as a main conductor component, laminating the green sheets with the conductor patterns formed thereon to form a lamination, and firing the lamination in a container made of boron nitride and in a pressurized nitrogen gas atmosphere.</p> |
申请公布号 |
EP0515061(A1) |
申请公布日期 |
1992.11.25 |
申请号 |
EP19920304119 |
申请日期 |
1992.05.07 |
申请人 |
FUJITSU LIMITED |
发明人 |
MAKIHARA, HIROSHI, FUJITSU LIMITED;OMOTE, KOJI, FUJITSU LIMITED;KAMEHARA, NOBUO, FUJITSU LIMITED;TSUKADA, MINEHARU, FUJITSU LIMITED |
分类号 |
C04B35/64;C04B41/51;C04B41/88;H01L21/48;H01L23/498;H05K1/03 |
主分类号 |
C04B35/64 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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