| 发明名称 |
DIE ATTACH ADHESIVE COMPOSITION |
| 摘要 |
A solid adhesive composition which is suitable for the very rapid attachment of IC chips to high surface energy substrates comprising flake silver particles dispersed in solid matrix consisting essentially of a thermoplastic phenoxy resin and a small amount of thermally crosslinkable resin. |
| 申请公布号 |
EP0454005(A3) |
申请公布日期 |
1992.11.25 |
| 申请号 |
EP19910106398 |
申请日期 |
1991.04.20 |
| 申请人 |
E.I. DU PONT DE NEMOURS AND COMPANY |
发明人 |
CHAN, MAN-SHEUNG |
| 分类号 |
C09J9/02;C09J11/04;C09J161/06;C09J161/20;C09J161/28;C09J171/00;C09J171/10;H01B1/22;H01L21/52;H01L23/482 |
主分类号 |
C09J9/02 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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