| 摘要 |
<p>PURPOSE:To obtain a highly durable non-contact signal processing device capable of maintaining an adequate breakdown strength against a static electricity applied from outside by holding a semiconductor circuit part from the upper and lower surfaces using a metal sheet or a metal film conductor. CONSTITUTION:A non-contact IC card, for example, consists of an IC chip 3 mounted on one surface of a printed circuit board 6 and coils for receiving and sending a signal with an external device, and required connects made using bonding wire 8 between such component parts through a circuit pattern. In addition, the other surface of the circuit board 6 is connected to GND level entirely over the IC. In addition, the periphery of a wire connected part including the IC chip 3 and the bonding wire 8 is formed in a resin mold or in an IC module 2 structured with a sealing frame 10 encircling the periphery of the IC chip 3. In the latter case, a conductor surface 11 is chemically plated after potting the sealing frame 10 or a conductive sheet is attached forcibly to the land part of a through hole 12 to form the conductor surface 11 on both sides of the IC module 2.</p> |
