发明名称 LAMINATED PRINTED-CIRCUIT BOARD
摘要 PURPOSE:To enable crosstalk to be reduced among all printed-circuit boards in a laminated printed-circuit board which is constituted by laminating a plurality of printed-circuit boards with a wiring pattern which is printed on a surface of a common substrate or a surface layer. CONSTITUTION:A GND or VCC screening layer 7 is provided between adjacent inner-layer wiring layers 3 and 4 of a laminated PCB and then all inner-layer wiring layers are sandwiched by the GND or VCC screening layer.
申请公布号 JPH04336494(A) 申请公布日期 1992.11.24
申请号 JP19910138488 申请日期 1991.05.13
申请人 MITSUBISHI ELECTRIC CORP 发明人 FUKUMOTO TAKAKAZU;MIYATAKE HIDEJI
分类号 H05K3/46 主分类号 H05K3/46
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