PACKAGE FOR SEMICONDUCTOR DEVICE

摘要

PURPOSE:To efficiently and easily perform a wiring for connecting terminals of a semiconductor device to external terminals even if the number of terminals of the devie mounted on a board is increased as compared with that of prior art. CONSTITUTION:A semiconductor integrated circuit or a semiconductor chip is mounted on one surface of a board 1, many external terminals 6 protrude on the other surface, and terminal pieces 4a of inner terminals of a mounting land 4 connected to the terminals of the circuit or the chip are respectively connected to external terminals through a wiring circuit 7 formed on the board. The external terminals are so disposed that the nearer to the land or the inner terminal they are, the wider the intervals between them get.