| 摘要 |
<p>PURPOSE:To provide a method for manufacturing an improved twodimensional environment calcination thick-film circuit substrate which has a simple line configuration as well as less facility investment amount, can keep a running cost of nitrogen gas to be approximately half as compared with before, and further can keep a dispersion of appearance resistance of a formed resistor to be small. CONSTITUTION:A thick-film resistor paste is calcined within air after printing and drying onto an alumina substrate 1 and then a resistor 2 is formed and then a thick-film glass paste is printed and dried without calcination after printing and drying of a thick-film Cu paste. By calcining both dry films simultaneously within nitrogen and then forming a wiring/parts land 3 and an overcoat glass 4 for protecting circuit simultaneously, a great effect can be realized in terms of line configuration, facility investment amount, running cost of nitrogen gas, and degree of dispersion of appearance resistance of resistor.</p> |
