| 摘要 |
PURPOSE:To obtain an inexpensive seal mechanism of a semiconductor manufacturing device, wherein the drive is made small by making small or removing the thrust loaded to a transfer member, and a manufacture of a semiconductor device. CONSTITUTION:The bellows for vacuum of a semiconductor substrate carrier 110a is divided in two of an upper part and a lower part by a hollow flange 8c, and the upper part is put in double structure consisting of an inner ring and an outer ring of bellows 8d and 8e, and an air introduction port 8g is provided in the hollow flange 8c so as to introduce air into the above bellows 8d and 8e, and by the vacuumization of the hollow flange 8c, it effects balance with the thrust occurring in the lower bellows 8f. |
