| 摘要 |
<p>PURPOSE:To provide a semiconductor IC which prevents a drop in the fault detection rate, even when pads are arranged in such a manner that all pads are, brought in contact several times, with a test probe card. CONSTITUTION:Input terminals of input buffers 2a and 2b which are connected to pads 1a and 1b, respectively, are connected to output terminals of the pads 1a and 1b and tri-state buffers 4a and 4b, wherein the pads 1a and 1b are not brought in contact with a probe pin 10 concurrently during a single contact of a probe card 11. These tri-state buffers, 4a and 4b, produce an output of signals inside of an LSI when the pads 1a and 1b are in an open circuit. To the contrary, the buffers enter the high impedance state when signals are inputted from outside the LSI at the pads 1a and 1b which are dedicated to an input purpose, and then the buffers output each inputted external signal.</p> |
