| 摘要 |
PURPOSE:To alleviate stress which is generated from the thermal contraction of a molding resin, and is exerted on the ball portion of a metal wiring. CONSTITUTION:A bonding pad 7, to be arranged on a semiconductor device 2, is recesed in the surface of the device. A ball portion 6 is bonded to the inside of the pad, so that at least one part of the ball is positioned below the surface level of the semiconductor device 2. |
