| 摘要 |
<p>PURPOSE:During the positioning of a semiconductor device on a die pad, to prevent thermal stress from being exerted on the device, and the device from being damaged. CONSTITUTION:A protuberance 2a formed on a die pad 2 is engaged with a counterpart recess 1a on the rear surface of a semiconductor device 1, as a result of which the device 1 can be positioned without the application of thermal stress on the die pad 2, thereby preventing damages to the device 1.</p> |
