| 摘要 |
<p>PURPOSE:To make it possible to protect a bonding wire from being crushed with a lid even when a chip on carrier is housed reversely by installing a large number of grooves which intersect each other on an inner surface of a packing lid, and setting the grooves extending in one direction as a chip protection space out of the grooves, and the grooves which intersect the above grooves as a bonding wire protection space. CONSTITUTION:A package case comprises a receiving pan 1 where a large number of semiconductor chip on carrier housing spaces 2 having a square- dented bottom are formed in matrix, a chip protection space and a bonding wire protection space 5 which are formed at a position equivalent to the semiconductor chip on carrier housing space and a packing lid 4 which can be removed from the receiving pans 1 with ease. In the packing case, there are installed a large number of grooves which intersects each other at right angles on the inside of the packing lid 4 where the grooves extending in one direction out of the grooves 5 and 6 are used as the chip protection spaces whereas the grooves intersecting the grooves 6 which constitute the chip protection spaces are used as the bonding wire protection spaces 5.</p> |
