| 摘要 |
PURPOSE:To provide the lead alloy brazing filler metal which has an excellent creep resistance characteristic and can improve the reliability of a semiconductor device without impairing the solderability. CONSTITUTION:This lead alloy brazing filler metal has a compsn. consisting of 0.5 to 10wt.% tin, 1 to 6wt.% silver, 0.01 to 0.5wt.% nickel, and the balance lead and unavoidable impurities and further, the compsn. contg. 0.01 to 0.5wt.% copper. |
