发明名称 WIRE BONDING METHOD
摘要 PURPOSE:To reduces the dependence on the reverse of reverse bonding for a long loop and provide a stabilized loop-controllable bonding method as for wire bonding which uses a capillary which penetrates wire in a movable fashion and carries out a first bonding and a second bonding one by one under the thrust and transfer of wire and installs the wire between two pints in the shape of loop. CONSTITUTION:A first bonding is a nail head bonding which carries out bonding by installing a ball 5 to the tip of wire 1 projecting from a capillary 2 where the ball is formed by the heat of the tip. It is arranged that tension is applied in such a fashion that the wire 1 is not subject to rupture when a soften portion produced by the heat near the ball 5 is cured on the wire 1 directly after the first bonding. The application of the tension is carried out by clamping the wire 1 with a clamp 3.
申请公布号 JPH04334034(A) 申请公布日期 1992.11.20
申请号 JP19910102990 申请日期 1991.05.09
申请人 FUJITSU LTD 发明人 KUBOTA AKIHIRO;OOSAWA MITSUHIRO
分类号 B23K20/00;H01L21/60 主分类号 B23K20/00
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