| 摘要 |
PURPOSE:To make it possible to form a solder bump produced by low melting point soldering as for the application of wire required to form the soldering bump and the formation method of the soldering bump based on the application of the wire. CONSTITUTION:A soldering wire 1 according to this invention comprises a metal core 2 used as a bonding wire, which is coated with solder 3. The formation method of a bump according to the present invention comprises the steps of forming a soldering ball 6 at the tip of the solder wire, depressing the soldering ball to a pad 9 so as to join, cutting the connection between the wire 1 and the soldering ball 6 and then shaping the form of the soldering ball 6 by using the surface tension when the soldering ball deformed by the extrusion pressure is heated and melted. |
