发明名称 |
A CIRCUIT UNIT FOR A TIMEPIECE AND A METHOD OF MAKING THE SAME |
摘要 |
A circuit unit including a plurality of lead frames which are made of a metal sheet and one of which is used for die-bonding an integrated circuit. The die-bonding lead member is formed to have at least a generally H-shaped portion constructed of a pair of parallel side portions and a connecting portion for connecting the two side portions for die-bonding the integrated circuit thereto. The remaining lead members are separated from said die-bonding one and have individual end portions positioned in the vicinity of the integrated circuit and connected electrically therewith by means of bonding wires. The die-bonding lead member and the remaining lead members are integrated either with a potting resin for protection the integrated circuit or with the potting resin and/or an insulating plate backing the potting resin. The aforementioned two side portions are fixed on a holding member. Also disclosed is a process for fabricating the aforementioned circuit unit. |
申请公布号 |
HK89392(A) |
申请公布日期 |
1992.11.20 |
申请号 |
HK19920000893 |
申请日期 |
1992.11.12 |
申请人 |
SEIKOSHA CO.,LTD. |
发明人 |
TSUYOSHI HAYAKAWA;SATORU YAMAUCHI;ISATO WATNABE;ISAO KONDO |
分类号 |
H01L23/50;G04G17/02;(IPC1-7):H01L23/28 |
主分类号 |
H01L23/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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