发明名称 LEAD RECEPTACLE FOR PRINTED BOARD
摘要 PURPOSE: To provide a lead socket which can be attached to a printed circuit board by soldering-joining on an upper surface of the printed circuit board and can receive leads of an electronic part in a detachable/attachable manner. CONSTITUTION: A lead socket S comprizes an outer sleeve 10 which is composed of a cylinder part 11 to be inserted from its upper surface side into an insertion hole 3 of a printed circuit board 1 and of a surface mount part 13 formed so as to extend laterally outward from an upper end part of this cylinder part 11 in an integrally connected manner, and an inner contact 20 made of a conductive material which is press-fitted into and held by a contact press-in hole 15 formed so as to open in the cylinder part upper end of this outer sleeve 10 and receives leads 41, 52 of an electronic part in a detachable/attachable manner. With the cylinder part 11 of the outer sleeve 10 inserted into the insertion hole 3, the outer sleeve 10 is fixed onto the printed circuit board 1 by reflow soldering-joining an under surface of the surface mount part 13, which makes hitting contact with a wiring pattern 2 on a top surface of the printed circuit board 1, to this wiring pattern 2.
申请公布号 JPH04334878(A) 申请公布日期 1992.11.20
申请号 JP19900410479 申请日期 1990.12.13
申请人 AUGAT INC 发明人 KANZAKI YUJI
分类号 H01R33/02;H01R33/76 主分类号 H01R33/02
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