DEVICE FOR SOLDERING.

摘要

A device for soldering provided with a pressing piece (4) to be pressed from above for pressing an electronic component part (3) to a printed board, and with a heating device (5) for heating said pressing piece to or above a melting temperature of soldering paste for the purpose of partially heating a joint portion only of a lead (3a) without heating the main body of the electronic component part (3) and preventing said part (3) from being damaged or deteriorated in performance by heat.