发明名称 |
Contact pin with solder tag for circuit board - has slit in underside of tag with varying width for reception and retention of liq. solder |
摘要 |
The contact portion (1) is built up on a base (11) under which the solder tag, pushed into a hole through the board (2), is divided by a slit (101) into two symmetrical parts (10A,10B). Recesses (106A,106B) in these form a chamber into which the solder is drawn. The hole has a dia. slightly less than the max. dia. of the tag at the level (107A,107B) from which the slit (101) tapers in opposite directions (103,104) downwards and upwards. ADVANTAGE - Pin is easily inserted by machine without delamination at holes, and improves solder flow by capillarity.
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申请公布号 |
DE4132996(A1) |
申请公布日期 |
1992.11.19 |
申请号 |
DE19914132996 |
申请日期 |
1991.10.04 |
申请人 |
TELEFUNKEN SYSTEMTECHNIK GMBH, 7900 ULM, DE |
发明人 |
MEYER, EDMUND, 6601 RIEGELSBERG, DE |
分类号 |
H01R12/58;H05K3/30;H05K3/34 |
主分类号 |
H01R12/58 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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