发明名称 Contact pin with solder tag for circuit board - has slit in underside of tag with varying width for reception and retention of liq. solder
摘要 The contact portion (1) is built up on a base (11) under which the solder tag, pushed into a hole through the board (2), is divided by a slit (101) into two symmetrical parts (10A,10B). Recesses (106A,106B) in these form a chamber into which the solder is drawn. The hole has a dia. slightly less than the max. dia. of the tag at the level (107A,107B) from which the slit (101) tapers in opposite directions (103,104) downwards and upwards. ADVANTAGE - Pin is easily inserted by machine without delamination at holes, and improves solder flow by capillarity.
申请公布号 DE4132996(A1) 申请公布日期 1992.11.19
申请号 DE19914132996 申请日期 1991.10.04
申请人 TELEFUNKEN SYSTEMTECHNIK GMBH, 7900 ULM, DE 发明人 MEYER, EDMUND, 6601 RIEGELSBERG, DE
分类号 H01R12/58;H05K3/30;H05K3/34 主分类号 H01R12/58
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