发明名称 |
SEMICONDUCTOR DEVICE ATTACHED ON A SUBSTRATE |
摘要 |
<p>A semiconductor chip 4 is attached to a ground plane layer 2 on a substrate 1 by a face down method through solder balls 7. A heat transfer material 5 attached to the ground plane layer 2 is in thermal contact with the semiconductor chip through a flexible heat transfer layer 9. The heat from the semiconductor chip is radiated by a large area by using the ground plane layer. The semiconductor chip and the heat transfer material are in contact with each other in a relatively movable state, to prevent that the thermal stresses from the substrate being exerted on the semiconductor chip. <IMAGE></p> |
申请公布号 |
EP0509732(A3) |
申请公布日期 |
1992.11.19 |
申请号 |
EP19920303277 |
申请日期 |
1992.04.13 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
NAKAMA, SUNAO;TSUCHIDA, SHUHEI |
分类号 |
H01L23/36;H01L21/60;H01L23/367;(IPC1-7):H01L21/60 |
主分类号 |
H01L23/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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